会议信息
SysInt 2014: International Conference on System-Integrated Intelligence
http://www.sysint-conference.org/截稿日期: |
2013-12-06 Extended |
通知日期: |
2013-12-20 |
会议日期: |
2014-07-02 |
会议地点: |
Bremen, Germany |
届数: |
2 |
浏览: 14078 关注: 0 参加: 0
征稿
Due to the great success of the 1st Joint Symposium, the organizers are proud to announce the 2nd Joint International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering, that will be held in Bremen from July 2nd (Wed.) to 4th (Fri.) 2014.
The conference provides a forum for academia and industry to present their latest research findings, innovations and practises in the field of systemintegrated intelligence. It focuses on the integration of advanced functional capabilities into materials, systems, parts and products as an enabling technology for established application scenarios as well as new products and services. The perspective is highly interdisciplinary. The technological basis extends from new sensor technologies via material-integrated sensing and intelligence to aspects of communication and data evaluation. It includes the implementation of such approaches in autonomous decision-making, self-optimization and control in advanced engineering products and systems.
The conference further addresses wider fields of research, such as materials science and engineering, microsystems technology, mechatronic systems and production engineering as well as electronics and computer science. Specific application environments in the field of robotics, structural health monitoring, production and logistics will be highlighted in the programme through definition of dedicated symposia. Studies on implementation of system-integrated intelligence in additional scenarios beyond this scope are highly welcome.
Individual topics of interest include, but are not limited to:
Methods and Algorithms: Agent-based systems, machine learning and biologically- inspired methods for optimization and planning
Self-Optimization and Autonomous Control: Design, reliability, modelling and validation
Sensorial Materials, material-integrated sensing and intelligence
Advanced Applications of Autonomous Objetcts and Systems
Human-Machine-Interaction: Visualization and transparency
Gentelligent Production
Cyber-Physical Systems in Production and Logistics
Perceptive Robotics
Structural Health Monitoring
最后更新 Dou Sun 在 2013-09-19
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相关期刊
| CCF | 全称 | 影响因子 | 出版商 | ISSN |
|---|---|---|---|---|
| c | ACM Transactions on Interactive Intelligent Systems | 3.600 | ACM | 2160-6455 |
| Swarm Intelligence | 2.100 | Springer | 1935-3812 | |
| c | Web Intelligence | 0.200 | IOS Press | 2405-6456 |
| IEEE Transactions on Circuits and Systems for Artificial Intelligence | IEEE | 2996-6647 | ||
| c | Applied Intelligence | 3.400 | Springer | 0924-669X |
| c | Computational Intelligence | 1.800 | John Wiley & Sons, Ltd. | 1467-8640 |
| a | Artificial Intelligence | 5.100 | Elsevier | 0004-3702 |
| IEEE Transactions on Artificial Intelligence | IEEE | 2691-4581 | ||
| International Journal of Computer Integrated Manufacturing | 3.700 | Taylor & Francis | 0951-192X | |
| c | Journal of Experimental and Theoretical Artificial Intelligence | 1.700 | Taylor & Francis | 0952-813X |
| 全称 | 影响因子 | 出版商 |
|---|---|---|
| ACM Transactions on Interactive Intelligent Systems | 3.600 | ACM |
| Swarm Intelligence | 2.100 | Springer |
| Web Intelligence | 0.200 | IOS Press |
| IEEE Transactions on Circuits and Systems for Artificial Intelligence | IEEE | |
| Applied Intelligence | 3.400 | Springer |
| Computational Intelligence | 1.800 | John Wiley & Sons, Ltd. |
| Artificial Intelligence | 5.100 | Elsevier |
| IEEE Transactions on Artificial Intelligence | IEEE | |
| International Journal of Computer Integrated Manufacturing | 3.700 | Taylor & Francis |
| Journal of Experimental and Theoretical Artificial Intelligence | 1.700 | Taylor & Francis |