Información de la conferencia
ICMPME 2018: International Conference on Materials Processing and Manufacturing Engineering
http://icmpme.org/index.htmlDía de Entrega: |
2018-06-10 Extended |
Fecha de Notificación: |
|
Fecha de Conferencia: |
2018-06-15 |
Ubicación: |
Qingdao, China |
Años: |
4 |
Vistas: 11539 Seguidores: 0 Asistentes: 0
Solicitud de Artículos
The 2018 4th International Conference on Materials Processing and Manufacturing Engineering (ICMPME 2018) aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Materials Processing and Manufacturing Engineering. The topics of interest for submission include, but are not limited to: Topics include but are not limited to the following areas: (I) Materials Science (1)Metals and Alloy materials (2)Energy materials (3)Nanomaterials (4)Environmental coordination materials (5)Biomedical Materials (6)Polymer science and technology (7)Polymer and composite materials (8)Ceramic materials and properties (9)Functional materials (10)Microelectronic materials (11)Materials chemistry (12)Synthesis and processing (13)Thin film growth process and properties (14)Surface treatment (15)Construction materials (16)Thermal management (II) Mechanical Engineering (17) Mechanical Dynamics and Vibration (18) Mechanical Strength (19) Mechanical Friction, Wear and Lubrication (20) Mechanical Design (21) Robot Technology and Applications (22) Vehicle Engineering (III) Manufacturing Processes and Systems (23) Surface Engineering/Coatings (24) Welding & Joining (25) Laser Processing (26) Powder Metallurgy (27) Severe Plastic Deformation (28) Tribology in Manufacturing Processes (29) Theory and Application of Friction and Wear (30) Casting and solidification (31) CAD/CAE/CAM (32) Rapid Prototyping, Manufacturing, and Tooling (33) Virtual Manufacturing, and Simulation
Última Actualización Por Dou Sun en 2018-05-01
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Revistas Relacionadas
| CCF | Nombre Completo | Factor de Impacto | Editor | ISSN |
|---|---|---|---|---|
| Mathematical Problems in Engineering | Hindawi | 1024-123X | ||
| Materials Science and Engineering: C | Elsevier | 0928-4931 | ||
| Materials Science and Engineering: B | 3.900 | Elsevier | 0921-5107 | |
| Journal of Materials Processing Technology | 7.5 | Elsevier | 0924-0136 | |
| Proceedings of the ACM on Software Engineering | ACM | 2994-970X | ||
| Procedia Manufacturing | Elsevier | 2351-9789 | ||
| IEEE Signal Processing Magazine | 9.6 | IEEE | 1053-5888 | |
| Microelectronic Engineering | 2.600 | Elsevier | 0167-9317 | |
| Advances in Materials Science and Engineering | Hindawi | 1687-8434 | ||
| Materials Science and Engineering: R: Reports | 26.8 | Elsevier | 0927-796X |
| Nombre Completo | Factor de Impacto | Editor |
|---|---|---|
| Mathematical Problems in Engineering | Hindawi | |
| Materials Science and Engineering: C | Elsevier | |
| Materials Science and Engineering: B | 3.900 | Elsevier |
| Journal of Materials Processing Technology | 7.5 | Elsevier |
| Proceedings of the ACM on Software Engineering | ACM | |
| Procedia Manufacturing | Elsevier | |
| IEEE Signal Processing Magazine | 9.6 | IEEE |
| Microelectronic Engineering | 2.600 | Elsevier |
| Advances in Materials Science and Engineering | Hindawi | |
| Materials Science and Engineering: R: Reports | 26.8 | Elsevier |