The conference is the third of a series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018 and in Amsterdam (The Netherlands), 2019 organized by IFSA. The MicDAT' 2020 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this 3-day conference.

A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2020 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas.

The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

We trust that you will find MicDAT' 2020 conference professionally rewarding and stimulating as well as enjoyable. 

The topics of interest include (but not limited):

    Analog, digital, mixed, and RF circuits and related design methodologies
    Analog-to-Digital Converters (ADC)
    Voltage-to-Frequency Converts (VFC)
    Frequency-to-Digital Converters (FDC)
    Time-to-Digital Converters (TDC)
    Semiconductor Devices: physics and technology
    Logic, architectural, and system level synthesis
    Nonlinear circuits
    Microprocessors, microcontrollers and DSPs
    Testing, design for testability, built-in self-test
    Area, power, and thermal analysis and design
    Mixed-domain simulation and design
    Embedded systems, low-power designs
    VLSI systems circuit and design
    Non-von Neumann computing and related technologies and circuits
    Design and test of high complexity systems integration
    SoC, MPSoC, NoC, SIP, and NIP design and test
    Process technologies, CMOS, BJT, BiCMOS, GaAs
    3-D integration design and analysis
    Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
    Design for Manufacturability/Technology Optimization/Yield & Quality
    Microelectronics processing and materials
    Semiconductor processing
    Modern electronics materials
    Solid-state electronics
    Quantum electronics
    Thin solid films
    Nanoprocessing, nanotechnology and nanofabrication​
    Flexible and stretchable electronics​
    MEMS and NEMS
    CAD tools for microelectronics
    Hardware/software co-design
    Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
    Electronic materials science and technology
    Organic electronic materials and devices
    Microelectronics reliability and qualification
    Assembly and Packaging

Contribution Types:

    Keynote presentations and invited talks
    Industrial presentations
    Special Sessions presentations
    Regular papers
    Posters
    Exhibition

Special Sessions:

Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.

Session organizers will get:

    Certificate of appreciation
    Free registration for the event
    Special publishing theme within conference proceedings
    Free article and book chapter post conference publications in appropriate open access journals and ‘Advances in Microelectronics: Reviews’, Book Series, Vol. 3