Conference Information
ICVES 2026: IEEE International Conference on Vehicular Electronics and Safety
https://ieee-icves.org/2026/Submission Date: |
2026-07-19 |
Notification Date: |
2026-08-23 |
Conference Date: |
2026-11-09 |
Location: |
Cochabamba, Bolivia |
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Call For Papers
Join us at the 20th IEEE International Conference on Vehicular Electronics and Safety (ICVES) 2026, an annual forum proudly sponsored by the IEEE Intelligent Transportation Systems Society (ITSS). ICVES is the premier interdisciplinary platform for researchers, practitioners, and policymakers to present and discuss the latest advances and research results in intelligent vehicular electronics and safety. The 2026 edition will take place in Cochabamba, Bolivia, a vibrant city at the heart of Latin America, highlighting regional innovations and fostering global collaborations to advance safe and sustainable mobility worldwide.
Topics
Authors are encouraged to submit papers related to vehicular electronics and safety. Accepted papers will be published in IEEE Xplore and may be delivered as either long or short interactive presentations, including poster sessions. Topics of interest include, but are not limited to, the following:
Vehicular Safety
Accident prevention technologies and crash analysis
Driving assistance systems for unstructured environments
Cybersecurity and safety protocols for intelligent vehicles
ITS Emerging Technologies and Applications
Frugal technologies for sustainable ITS applications
Smart infrastructure and connected vehicles
AI and machine learning for traffic management
Vehicle-To-Everything (V2X) and Cellular V2X
Vehicular Electronics
Embedded systems and automotive software
Sensor fusion and electronic control units (ECUs)
Vehicle architectures for AI enabled systems
Electric and Autonomous Vehicles
Battery management systems (BMS)
Power electronics for electric vehicles
Metrics, verification and validation of intelligent vehicles
Cyber-Physical Systems
Safety-critical hardware/software systems
IoT-based vehicular networks
Blockchain and secure vehicular communication
Datasets
Automotive: Northern and Southern hemispheres
Synthetic datasets
Tools (curation, labelling, …)
Last updated by Dou Sun in 2025-11-19
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| Full Name | Impact Factor | Publisher |
|---|---|---|
| IEEE Open Journal of the Industrial Electronics Society | 5.200 | IEEE |
| Electronic Markets | 6.8 | Springer |
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| Chinese Journal of Electronics | CIE | |
| Neuroelectronics | ELSP | |
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