Información de la conferencia
EIT' 2026: International Conference on Biomedical Applications of Electrical Impedance Tomography
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Día de Entrega: |
2026-05-01 |
Fecha de Notificación: |
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Fecha de Conferencia: |
2026-07-06 |
Ubicación: |
Sheffield, UK |
Años: |
26 |
Vistas: 177 Seguidores: 0 Asistentes: 0
Solicitud de Artículos
We are delighted to announce that EIT 2026 conference will be hosted by Prof. Richard Bayford in Sheffield, the birthplace of the EIT.
Building on the rich tradition of previous EIT Conferences, this event offers a vibrant platform for researchers and clinicians from across the globe to share their expertise and insights into the medical applications of Electrical Impedance Tomography, Magnetic Induction Tomography, and Magnetic Resonance Electrical Impedance Tomography.
The conference will explore a wide range of topics, including:
Clinical applications of Impedance Imaging
Hardware for Impedance Imaging
Software for Impedance Imaging
Algorithms and Data Analysis
Inverse Problems and Theory
Bioimpedance and the Dielectric Properties of Biological Tissues
Related developments in Geophysics and Process Tomography with potential crossover to biomedical applications
We warmly invite you to join us for an inspiring exchange of ideas, innovations, and experiences in this dynamic field.
Building on the rich tradition of previous EIT Conferences, this event offers a vibrant platform for researchers and clinicians from across the globe to share their expertise and insights into the medical applications of Electrical Impedance Tomography, Magnetic Induction Tomography, and Magnetic Resonance Electrical Impedance Tomography.
The conference will explore a wide range of topics, including:
Clinical applications of Impedance Imaging
Hardware for Impedance Imaging
Software for Impedance Imaging
Algorithms and Data Analysis
Inverse Problems and Theory
Bioimpedance and the Dielectric Properties of Biological Tissues
Related developments in Geophysics and Process Tomography with potential crossover to biomedical applications
We warmly invite you to join us for an inspiring exchange of ideas, innovations, and experiences in this dynamic field.
Última Actualización Por Dou Sun en 2026-03-05