CONFERENCE TOPICS 

    Advanced Packaging: Advanced Flip-chip, 2.5D & 3D,PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter-wave, Power and Rugged Electronics Packaging etc.
    TSV/Wafer Level Packaging: Wafer level packaging ( Fan in/Fan out), embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
    Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb-free) etc.
    Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
    Materials and Processing: advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, Leadframes, PCB etc for advanced packaging, and assembly processes using advanced materials.
    Equipment and Process Automation: new processes development, equipment automation, equipment hardware development/ improvements, data analytics, in-situ metrology.
    Electrical Simulations & Characterization: Power plane modeling, signal integrity analysis of package. 2D/2.5D/3D package level high-speed signal design, characterization and test methodologies, etc.
    Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, shock and drop modeling, Chip-package interaction, etc.
    Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component, system and product level thermal management and characterization.
    Quality, Reliability & Failure Analysis: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.