会議情報
ICMSNT 2018: International Conference on Materials Science and Nanotechnology
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提出日:
2018-03-15 Extended
通知日:
2018-03-18
会議日:
2018-03-29
場所:
Chengdu, China
年:
3
閲覧: 12656   追跡: 0   出席: 0

論文募集
Welcome to the official website of 2018 3rd International Conference on Materials Science and Nanotechnology (ICMSNT 2018). ICMSNT 2018 is co-organized by Southwest Jiaotong University,Swinburne University of Technology, The University of Auckland and Hong Kong Society of Mechanical Engineers, technically sponsored by Changzhou Institute of Technology, Jiangsu University of Science and Technology and Jiangsu Cultural and Creative Collaborative Innovation Center. The conference will be held at Chengdu, China, from Mar. 29-Apr. 1, 2018!

ICMSNT 2016 and ICMSNT 2017 were successfully held in Seoul and Auckland. ICMSNT 2018 is an international forum for the presentation of technological advances and research results in the fields of Materials Science and Nanotechnology. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome prospected authors submit your new research papers to ICMSNT 2018, and share the valuable experiences with the scientist and scholars around the world.

ICMSNT 2018 is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper. The submitted paper should be in PDF format.

The other topics of interest are included below, but not limited to:

Functional Materials (Energy, Environment, Electronic, Optical, Magnetic and Spintronic)
Structural Materials (Metal, Ceramics, Polymer)
Composites
Nano materials
Biomaterials and Healthcare
Surface Science and Technology (including tribology, fatigue and corrosion)
Materials Modeling and Simulation
Materials Characterization
Advanced Manufacturing Technologies
Nanotechnologies (Nanobiology, Nanotribology, Nanoelectronics, Nanomagnetics, Nanoenergy, NEMS/MEMS)
Other related topics
最終更新 Dou Sun 2018-03-03
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関連仕訳帳
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Journal of Materials Processing Technology7.5Elsevier0924-0136
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