Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)

Theme 1: Digital & System Level IC

Track 1：Digital Architectures & Systems

FPGA Circuits Design & Application
Processors, Accelerators & SoCs
Memory System & Process in Memory
System Level Testability & Reliability

Track 2：Digital Circuits

Digital Blocks
Logical/Physical-Level Security
Non-volatile Memory & Volatile Memory
Circuit Level Reliability Design

Track 3：Design Methodology & EDA

Design for Testability, Reliability & Manufacturability
Modeling，Simulation & Emulation
Design & Technology Co-Optimization
Artificial Intelligence Algorithms for EDA

Theme 2: Analog

Track 4：RF & Wireless

Building Blocks at RF, mm-wave and THz
Rx, Tx or TRx for Wireless Systems
Wireless Sensor, Radar, Imager
Device/Packaging/Modeling at RF, mm-wave and THz

Track 5：Wireline

Electrical/Optical Transmitters/Receivers for Wireline
Clock Generation and Distribution Circuits
Building Blocks for High-Speed Wireline Communications

Track 6：General Analog

Advanced Analog Circuits
High-Speed, High-Precision Data Converters
Imagers, Medical Devices & Display Systems
Efficient Power Management Circuits

Theme 3: Devices

Track 7：CMOS Logic Devices & Sensors

Advanced CMOS Logic Devices
2D & Thin Film Devices & Technologies
Flash & Non-Volatile & 3D Memory Technologies
Sensor, Sensing Microsystem, MEMS, and Bioelectronics
Smart/Intelligent Sensors & Actuators
Device Modeling & Simulation

Track 8：Power Devices & Power IC

Silicon-based Power Devices
Wide Bandgap Power Devices
Power Integrated Circuits、modules & Systems
Power Integrating & Packaging Technology
Power Device Reliability
Power Device Modeling & Simulation

Track 9：Device Reliability & Security

Back-End of Line Reliability & ESD
Aging & Remaining Useful Lifetime Prediction
PUF & Hardware Security
Devices Radiation Reliability

Theme 4: Process & Technologies

Track 10：Semiconductor Process Technologies

Compound Semiconductor Materials & Technologies
Advanced Memory Materials & Technologies
Advanced Process Technologies
Advanced Interconnect Technologies
Process Modeling & Simulation

Track 11：Optoelectronics and Silicon Photonics Integration

High-Speed Optoelectronic Devices
Silicon Photonics & Integration
Photonic Sensors & Image Sensors
Optical Computing Devices
Display Process & Integration

Track 12：Packaging Technologies

2.5D & 3D Integration
Heterogeneous Integration Packaging
Advanced Wire Bonding Technology
Modeling and Simulation for Advanced Packaging
Testing and Reliability in Advanced Packaging