Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)

Theme 1: Digital & System Level IC

Track 1：Digital Architectures & Systems

    FPGA Circuits Design & Application
    Processors, Accelerators & SoCs
    Memory System & Process in Memory
    System Level Testability & Reliability

Track 2：Digital Circuits

    Digital Blocks
    Logical/Physical-Level Security
    Non-volatile Memory & Volatile Memory
    Circuit Level Reliability Design

Track 3：Design Methodology & EDA

    Design for Testability, Reliability & Manufacturability
    Modeling，Simulation & Emulation
    Design & Technology Co-Optimization
    Artificial Intelligence Algorithms for EDA

Theme 2: Analog

Track 4：RF & Wireless

    Building Blocks at RF, mm-wave and THz
    Rx, Tx or TRx for Wireless Systems
    Wireless Sensor, Radar, Imager
    Device/Packaging/Modeling at RF, mm-wave and THz

Track 5：Wireline

    Electrical/Optical Transmitters/Receivers for Wireline
    Clock Generation and Distribution Circuits
    Building Blocks for High-Speed Wireline Communications

Track 6：General Analog

    Advanced Analog Circuits
    High-Speed, High-Precision Data Converters
    Imagers, Medical Devices & Display Systems
    Efficient Power Management Circuits

Theme 3: Devices

Track 7：CMOS Logic Devices & Sensors

    Advanced CMOS Logic Devices
    2D & Thin Film Devices & Technologies
    Flash & Non-Volatile & 3D Memory Technologies
    Sensor, Sensing Microsystem, MEMS, and Bioelectronics
    Smart/Intelligent Sensors & Actuators
    Device Modeling & Simulation

Track 8：Power Devices & Power IC

    Silicon-based Power Devices
    Wide Bandgap Power Devices
    Power Integrated Circuits、modules & Systems
    Power Integrating & Packaging Technology
    Power Device Reliability
    Power Device Modeling & Simulation

Track 9：Device Reliability & Security

    Back-End of Line Reliability & ESD
    Aging & Remaining Useful Lifetime Prediction
    PUF & Hardware Security
    Devices Radiation Reliability

Theme 4: Process & Technologies

Track 10：Semiconductor Process Technologies

    Compound Semiconductor Materials & Technologies
    Advanced Memory Materials & Technologies
    Advanced Process Technologies
    Advanced Interconnect Technologies
    Process Modeling & Simulation

Track 11：Optoelectronics and Silicon Photonics Integration

    High-Speed Optoelectronic Devices
    Silicon Photonics & Integration
    Photonic Sensors & Image Sensors
    Optical Computing Devices
    Display Process & Integration

Track 12：Packaging Technologies

    2.5D & 3D Integration
    Heterogeneous Integration Packaging
    Advanced Wire Bonding Technology
    Modeling and Simulation for Advanced Packaging
    Testing and Reliability in Advanced Packaging